What the work involves

You will review and classify defects captured through scanning electron microscopy, interpret wafer sort and parametric data, and connect observed patterns to plausible yield-loss mechanisms. Assignments may include building defect paretos, investigating excursions, tracing likely process sources, and making evidence-based lot-hold or release recommendations. Findings must be documented clearly enough to become useful training or evaluation material for AI systems.

What screening is likely to cover

Expect detailed questions about work performed in production fabs, including the products or process areas supported, your SEM defect-review workflow, and how you used bin maps or test-floor data during investigations. The screen may also test judgment through ambiguous defect classifications, conflicting data, and excursion scenarios. Specific examples with measurable evidence will carry more weight than general descriptions of yield engineering. No prior AI experience is required.

Practical details

This is a remote contractor role. The listing does not disclose whether assignments are fully asynchronous, the expected weekly commitment, or the engagement duration, so candidates should confirm those points with micro1 during screening.

Pay band: $20–60/hr